Advantages and Benefits

Simple Process:Dipping method

Mass Production capability, short process time & low process temperature
Beyond dipping, methods such as spraying and smearing are applicable.

Fully automated processes


Coverage of Complex 3D Surfaces

  • Coverage of complex 3D surfaces
  • Traditional PVD/CVD[1] technologies hardly form conformal and uniform thin film on 3D structures, causing defects and therefore film peeling.
  • DAZZEON Liquid has low viscosity that is good for dipping method
  • 2.0 mPa·s[2] @ 25 °C (similar to propanol)
  • Process at low temperature (55-130 °C)
Completely 100% filled
Poor (non-conformal) step
coverage is easy to peel.


  • Introduction of nanoparticles to surface micropores, fulfilling voids and forming a strong molecular bonds with the surface
  • Extremely minimal surface layer addition
2.19 nm
2.19 nm

Without treatment

0.48 nm
0.48 nm

Treated with DAZZEON

Quantum tunneling effect

If the barrier is thin enough, electrons can pass through.

  • Moisture resistant with zero impact to the electrical conductivity.
  • Spot component replacement (ex. soldering)
  • The SEM pictures show there is almost no thin film barrier.

Advantages and Benefits